Hybrid imaging sensor for structured light object capture
US10574909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2016 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A three dimensional imaging system includes a hybrid imaging sensor with infrared wavelength photoreceptors and visible wavelength photoreceptors integrated in one photoreceptor array. The three dimensional imaging system includes a bandpass filter to filter incoming light before the light is received at the hybrid imaging sensor to reduce crosstalk between the infrared wavelength photoreceptors and visible wavelength photoreceptors. The infrared photoreceptors receive infrared light provided by a structured light source and the visible wavelength photoreceptors receive ambient visible light. The hybrid imaging sensor collects infrared image data and visible light image data concurrently and/or simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.