Speaker apparatus having a heat dissipation structure
US10575098B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2018 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Feb 13, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.