Electroconductive paste, electronic substrate, and method for manufacturing said substrate
US10575412B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
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Key dates
| Filing date | Dec 27, 2016 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Dec 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/086
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroconductive paste comprises high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at the firing temperature, for which the melting point is 700° C. or less; active metal particles containing an active metal; and an organic vehicle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.