Microstructured packaging surfaces for enhanced grip
US10575667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | May 4, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/3874
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A label with improved physical properties comprising: a base layer having a microstructured area; a composite microstructure having a first, second and third set of microstructures disposed on the microstructured area; a dry lift force attributable to the composite microstructure greater than 7 pounds according to lift testing; a wet lift force attributable to the composite microstructure greater than 7 pounds according to lift testing; an adhesive layer affixed to the base layer for affixing the label to a container; and, thereby providing a microstructured label having improved gripping physical properties that can be affixed to a container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.