Ultrasonic transducer
US10575820B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Feb 7, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/0622
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasonic transducer may include a piezoelectric wafer and backing layers. The backing layers may include a high impedance backing layer and a low impedance backing layer. The back surface of the piezoelectric wafer may be connected with the front surface of the high impedance backing layer, and the back surface of the high impedance backing layer may be connected with the front surface of the low impedance backing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.