Methods and apparatuses for assembling elastic laminates with different bond densities for absorbent articles
US10575993B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Jan 19, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2556/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The methods herein relate to assembling an elastic laminate with a first elastic material and a second elastic material bonded between first and second substrates. During assembly, an elastic laminate may be formed by positioning the first and second substrates in contact with stretched central regions of the first and second elastic materials. The elastic laminates may include two or more bonding regions that may be defined by the various layers or components of the elastic laminate that are laminated or stacked relative to each other. In some configurations, a first plurality of ultrasonic bonds are applied to the elastic laminate to define a first bond density in the first bonding region, and a second plurality of ultrasonic bonds are applied to the elastic laminate to define a second bond density in the second bonding region, wherein the second bond density is not equal to the first bond density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.