Solder paste misprint cleaning
US10576566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2016 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Nov 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.