Cooling system for use with a power electronics assembly and method of manufacturing thereof
US10576589B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
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Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Sep 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for use with a power electronics assembly comprising an array of line-replaceable units is provided. The cooling system includes a first manifold coupled in flow communication with the array of line-replaceable units, and a fluid supply coupled in flow communication with the first manifold. The fluid supply is configured to channel cooling fluid towards the first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.