Apparatus, system and method for providing an end effector

US10576639B2 · kind B2 · utility

Assignee

• JABIL INC.

Inventors

• Jeroen Bosboom · St. Petersburg, US
• Babak Naderi · St. Petersburg, US
• Richard Munro · St. Petersburg, US
• Tatiana Pankova Major · St. Petersburg, US

Key dates

• Filing date: Feb 6, 2018
• Grant date: Mar 3, 2020
• Expiry date: Apr 30, 2038

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S414/141
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.