Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material
US10576651B2 · kind B2 · utility
0Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2016 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Jan 22, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/304
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.