Thermally stable microstructured semi-IPN layer
US10577451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2016 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Sep 5, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermally stable microstructured layers comprising polyurethane, polyurea and/or polyurethane/urea semi-IPN materials are provided which have microstructured surfaces which are highly durable, erosion resistant, and thermally stable. The microstructured layer comprises a semi-IPN of a polymer network selected from the group consisting of urethane acrylate polymer networks, urethane/urea acrylate polymer networks and urea acrylate polymer networks and a linear or branched polymer that is a thermoplastic polymer selected from the group consisting of thermoplastic polyurethanes, thermoplastic polyurethane/polyureas, thermoplastic polyureas, and combinations thereof. The microstructures are thermally stable at temperatures above the crossover point of the thermoplastic polymer, despite comprising a majority of such thermoplastic material. In another aspect, the present disclosure provides methods of making microstructured layers according to the present disclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.