Patent · US Active

Method for curing curable compositions

US10577471B2 · kind B2 · utility

0Cited by
2References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 6, 2015
Grant dateMar 3, 2020
Priority date
Expiry dateMay 26, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J133/064
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The invention relates to a process for the curing of latently reactive, heat-curable compositions which do not harden at room temperature. The composition includes a polymer obtainable via reaction of certain compounds having two aldehyde groups with polyacrylate compounds having two or more acrylate groups, and also a compound which bears at least two thiol groups.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.