Pattern forming method
US10578965B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Oct 24, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0046
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A pattern is formed on a substrate with a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound and a component (b2) serving as a photopolymerization initiator dropwise discretely onto the curable composition (A1) layer to lay the droplets, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the layer, and releasing the mold from the mixture layer after the curing, a Distance in Hansen space Ra((a1)−(A2)) between the component (a1) serving as a polymerizable compound in the curable composition (A1) and the curable composition (A2) being 6 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.