Electronic device glass structure
US10579165B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Mar 15, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04102
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device structure and an ultra-thin glass sheet used therein. The electronic device structure includes a functional device and an ultra-thin glass above the functional device. The ultra-thin glass has a thickness of no more than 0.4 mm and also has a toughening layer, of which the thickness does not exceed 50% of the thickness of the ultra-thin glass. The ultra-thin glass has a total thickness variation of no more than 20 μm. The ultra-thin glass used in the electronic device structure according to the present invention provides quality assurance for subsequent potential processes, such as cutting, drilling, coating, screen-printing, laminating, gluing and the like, due to the toughening layer. Moreover, the ultra-thin glass improves functionality of the electronic device structure, in particular of the device, due to its small total thickness variation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.