Chip on film package and flexible substrate thereof
US10580729B2 · kind B2 · utility
4Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Apr 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.