Electronic component
US10580750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Aug 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/08
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component includes: four device chips having rectangular planar shapes and arranged on a substrate so that a corner of four corners constituting a rectangle of one device chip is adjacent to the corners of remaining three device chips; first pads located on surfaces of the four device chips and closest to the corner; one or more first bumps bonding the first pads to the substrate in the four device chips; second pads located on surfaces of the four device chips, the second pad being one of pads other than the first pad; and one or more second bumps bonding the second pads to the substrate in the four device chips, a sum of bonded areas between the one or more second bumps and the second pad being less than a sum of bonded areas between the first pad and the one or more first bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.