Patent · US Active

Systems in packages including wide-band phased-array antennas and methods of assembling same

US10580761B2 · kind B2 · utility

7Cited by

3References

21Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bok Eng Cheah · Air Itam, MY
Jackson Chung Peng Kong · Merang, MY
Boon Ping Koh · Permatang Janggus, MY
Kooi Chi Ooi · Air Itam, MY

Key dates

Filing date	Jun 26, 2018
Grant date	Mar 3, 2020
Priority date	—
Expiry date	Jul 1, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-in-package includes a package substrate that at least partially surrounds an embedded radio-frequency integrated circuit chip and a processor chip mated to a redistribution layer. A wide-band phased-array antenna module is mated to the package substrate with direct interconnects from the radio-frequency integrated circuit chip to antenna patches within the antenna module. Additionally, fan-out antenna pads are also coupled to the radio-frequency integrated circuit chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.