Solid-state imaging device, camera module, and electronic apparatus
US10580816B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 22, 2015 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Oct 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8027
Abstract
The present technology relates to a solid-state imaging device capable of preventing defects in the appearance thereof, a camera module, and an electronic apparatus. The solid-state imaging device to be provided includes: a semiconductor substrate having pixels formed therein, the pixels each including a photoelectric conversion element; and on-chip lenses formed above the semiconductor substrate, the on-chip lenses corresponding to the pixels. The area in which the on-chip lenses are formed is extended to a peripheral area outside an imaging area formed with the pixels. The present technology can be applied to solid-state imaging devices, such as CMOS image sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.