Method of fabricating an electrical circuit assembly on a flexible substrate
US10580830B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Jul 7, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an electrical circuit assembly on a flexible substrate comprises: identifying one or more bending-sensitive elements of an electrical circuit assembly, each bending-sensitive element having a performance that varies when said bending-sensitive element is flexed; splitting said one or more bending-sensitive elements into a first portion and a second portion, wherein the first portion and the second portion are functionally equivalent and together equate to said bending-sensitive element; printing the first portion of said bending-sensitive element on a first surface of the flexible substrate; printing the second portion of said bending-sensitive element on a second surface of the flexible substrate, diametrically opposite the first portion such that bending of the flexible substrate has an opposite effect on each of the first and second portions thereby serving to substantially cancel the effect on each portion out; and electrically connecting the first portion and the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.