Integrated circuit devices
US10580876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Mar 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/691
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device may include a pair of line structures. Each line structure may include a pair of conductive lines extending over a substrate in a first horizontal direction and a pair of insulating capping patterns respectively covering the pair of conductive lines. The integrated circuit device may include a conductive plug between the pair of line structures and a metal silicide film contacting a top surface of the conductive plug between the pair of insulating capping patterns. The conductive plug may have a first width between the pair of conductive lines and a second width between the pair of insulating capping patterns, in a second horizontal direction perpendicular to the first horizontal direction, where the second width is greater than the first width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.