Optoelectronic device and the manufacturing method thereof

US10580937B2 · kind B2 · utility

Assignee

• Epistar Corporation · TW

Inventors

• Chun Lin · Yardley, US
• Yung-Fu Chang · Ithaca, US
• Rong-Ren Lee · Hsinchu, TW
• Kuo-Feng Huang
• Cheng-Long Yeh · Hsinchu, TW
• Yi-Ching Lee · Hsinchu, TW
• Ming-Siang Huang · Hsinchu, TW
• Ming-Tzung Liou · Hsinchu, TW

Key dates

• Filing date: Dec 20, 2018
• Grant date: Mar 3, 2020
• Expiry date: Dec 20, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/819

Abstract

An optoelectronic device includes a semiconductor structure having a first side and a second side opposite to the first side, a first pad at the first side, a first finger connected to the electrode pad and having a first width, an insulating layer at the second side and comprising a first part under the first finger, the first part having a bottom surface with a second width larger than the first width and a side surface inclined to the bottom surface, and a contact layer covering the bottom surface and the side surface.