Patent · US Active

Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component

US10580942B2 · kind B2 · utility

0Cited by

5References

8Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Luca Haiberger · Regensburg, DE
Matthias Sperl · Mintraching, DE

Key dates

Filing date	Jan 22, 2018
Grant date	Mar 3, 2020
Priority date	—
Expiry date	Jan 22, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/036
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.