Semiconductor integrated circuit device
US10581414B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2016 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.