Printed circuit board (PCB) mount for headphone earcup
US10582292B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Dec 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/033
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various implementations include printed circuit board mounts and related headphone systems employing such mounts. In one implementation, a mount for a printed circuit board (PCB) includes: a plate for matingly engaging an inner portion of a headphone earcup, the plate including at least one PCB mount for coupling with the PCB; and a coupling element extending from the plate and including at least one coupler for coupling the plate proximate to a spine extending through the inner portion of the headphone earcup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.