Printed wiring board, printed circuit board, and electronic device
US10582615B2 · kind B2 · utility
7Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Nov 16, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a printed wiring board comprising: a substrate; a conductive layer including a land and a wiring and formed on a surface of the substrate, the wiring having a width smaller than the land and drawn from the land; and an insulating layer formed on the conductive layer. The insulating layer has an opening corresponding to a position of the land, and an edge of the opening runs above the land and above one of edges in a width direction of the wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.