Method of fabricating a circuit module
US10582617B2 · kind B2 · utility
0Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Feb 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.