Liquid cooling distribution in a modular electronic system
US10582639B1 · kind B1 · utility
17Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20645
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.