Overmolded electronic components for transaction cards and methods of making thereof
US10583594B2 · kind B2 · utility
8Cited by
11References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 14, 2019 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Jun 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.