Method for forming dye sublimation images in and texturing of solid substrates
US10583686B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2018 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44C1/24
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for texturing a plastic substrate, while forming a dye sublimation image in the plastic substrate is provided. A first side of a dye carrier sheet having an image formed thereon of a dye sublimation ink is placed on a second side of the plastic substrate to form a stack. A first side of a textured cover is placed on a side of the stack. A clamping pressure is provided on the textured cover and the stack, wherein the stack and textured cover are clamped together. The stack is heated to at least a sublimation temperature of the stack, which causes the dye sublimation ink to sublimate and penetrate through the second side of the plastic substrate, creating a dye sublimation image in the plastic substrate and wherein texture from the textured cover is transferred to a side of the plastic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.