Patent · US Active

Polymer compositions having improved EMI retention

US10583691B2 · kind B2 · utility

1Cited by

11References

7Claims

0Family size

Assignee

SABIC GLOBAL TECHNOLOGIES B.V. · NL

Inventors

Tong Wu · Västerås, SE
Will Li · Shanghai, CN
David Xiangping Zou · Shanghai, CN

Key dates

Filing date	Feb 27, 2012
Grant date	Mar 10, 2020
Priority date	—
Expiry date	Feb 27, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01B1/22
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Polymer compositions having improved electromagnetic (EMI) shielding properties under high temperature are disclosed. The polymer compositions comprise a thermoplastic polymer, stainless steel fiber, and optionally one or more of glass fiber, a conductive filler, a second polymer, and other additives. The disclosed compositions maintain heat resistance and other mechanical properties under high temperatures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.