Manufacturing method of glass substrate with hole
US10584053B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 2, 2017 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Jan 28, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A manufacturing method of a glass substrate with a hole having a diameter ϕf, and with a thickness θf includes setting a thickness θ1 of a glass plate that is to be processed; preparing a glass plate with the thickness θ1, having first and second surfaces opposite to each other; forming one initial characteristic object or two or more initial characteristic objects in the glass plate by irradiating the glass plate with a laser from a side of the first surface of the glass plate, the initial characteristic object having a size of a diameter ϕ1 on the first surface; and performing wet etching for the glass plate having the initial characteristic object, so that from the initial characteristic object a hole having the diameter ϕf on the first surface is formed, and a thickness of the glass plate is adjusted from θ1 to a target value of θf.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.