High solids epoxy coatings
US10584261B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2013 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Dec 5, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/24
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A coating composition including a blend of at least two or more epoxy resins, wherein at least one of the epoxy resins comprises (i) a CHDM epoxy resin having less than about 2 wt % total chlorine content; and wherein at least one of the epoxy resins comprises (ii) at least one other epoxy resin other than the epoxy resin in component (i); a curable coating composition including (a) the above blend of epoxy resins and (b) at least one amine curing agent; a thermoset coating product prepared from the above curable composition; and a process for preparing the above compositions and a coating therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.