Electrochemical etching apparatus
US10584425B2 · kind B2 · utility
0Cited by
7References
7Claims
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Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Jun 18, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B32/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating etching apparatus includes a power to output current, and a container configured to contain an electrolyte. A cathode is coupled to the container and configured to fluidly communicate with the electrolyte. An anode is electrically connected to the output, and includes a graphene layer. A metal substrate layer is formed on the graphene layer, and is etched from the graphene layer in response to the current flowing through the anode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.