Hollow cathode plasma source
US10586685B2 · kind B2 · utility
0Cited by
69References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Dec 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H2245/42
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a hollow cathode plasma source and to methods for surface treating or coating using such a plasma source, comprising first and second electrodes (1, 2), each electrode comprising an elongated cavity (4), wherein dimensions for at least one of the following parameters is selected so as to ensure high electron density and/or low amount of sputtering of plasma source cavity surfaces, those parameters being cavity cross section shape, cavity cross section area cavity distance (11), and outlet nozzle width (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.