Patent · US Active

Handle for semiconductor-on-diamond wafers and method of manufacture

US10586850B2 · kind B2 · utility

0Cited by

1References

22Claims

0Family size

Assignee

RFHIC Corporation · KR

Inventors

Quentin Diduck · Santa Clara, US
Daniel Francis · Oakland, US
Frank Yantis Lowe · Berkeley, US
Felix Ejeckam · San Francisco, US

Key dates

Filing date	Dec 5, 2017
Grant date	Mar 10, 2020
Priority date	—
Expiry date	Feb 1, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24355
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Methods for mounting and dismounting thin and/or bowed semiconductor-on-diamond wafers to a carrier are disclosed that flatten said wafers and provide mechanical support to enable efficient semiconductor device processing on said semiconductor-on-diamond wafers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.