Multi-layer substrate with integrated resonator
US10587029B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Jul 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0085
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a substrate that includes a substrate body and a resonator integrated within the substrate body. The resonator includes a resonator body, a top resonator plate, and a bottom resonator plate. The resonator body extends through the substrate body from a top surface to a bottom surface of the substrate body, and is formed of at least one of a dielectric material and a magnetic material. The top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body. The top resonator plate and the bottom resonator plate are electrically conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.