Patent · US Active

Flip-chip beamforming integrated circuit with integral thermal mass

US10587044B2 · kind B2 · utility

3Cited by

9References

20Claims

0Family size

Assignee

Anokiwave, Inc. · US

Inventors

Vipul Jain · Irvine, US
Noyan Kinayman · Malden, US
Robert J. McMorrow · Concord, US
Kristian N. Madsen · Napa, US
Shamsun Nahar · San Diego, US
Nitin Jain · San Diego, US

Key dates

Filing date	Oct 24, 2017
Grant date	Mar 10, 2020
Priority date	—
Expiry date	Feb 10, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/066
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, a bottom surface, and a plurality of interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a plurality of static interfaces and a plurality of RF interfaces. The plurality of static interfaces are on the bottom surface of the microchip and adjacent to each other. The plurality of RF interfaces are also on the bottom surface of the microchip, but radially outward of the plurality of static interfaces. The microchip is configured to be flip chip mounted.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.