Connection structure for laser and laser assembly
US10587093B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02469
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.