Preparation method of flexible transparent circuit
US10588217B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2018 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Jul 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.