Method and apparatus for forming on a substrate a pattern of a material
US10588221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2012 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0528
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for forming on a substrate (108; 214) a pattern of a material, the method comprising: providing (S100) a material layer (104); providing (S104, S106) an adhesive layer (106), wherein at least one of the material layer (104) or the adhesive layer (106) comprises a pattern corresponding to the pattern to be formed on the substrate (108; 214); and transferring (S108) the material to the substrate (108; 214) with the adhesive fixing the material to a surface (110; 216) of the substrate (108; 214). This solves the problem of forming on a substrate a pattern of a material that, in general, cannot be applied to the substrate directly due to the fact that the material cannot be printed and/or has no or reduced adherence properties with respect to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.