Hermetically sealed printed circuit boards
US10588231B2 · kind B2 · utility
490Cited by
15References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2018 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Apr 6, 2038 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2090/0813
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of assembling a hermetically sealed printed circuit board includes: securing a first end portion of a wall of a cap to a substrate around an electrical contact region of the substrate, the wall including a second end portion disposed in an open configuration; mounting an electronic component to the electrical contact region of the substrate; and sealing the second end portion of the wall closed to form a hermetically sealed chamber between the substrate and the cap to encase the electronic component therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.