Assembly for extracting heat from a housing for electronic equipment
US10588245B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2012 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Mar 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20745
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly for extracting heat from a housing for electronic equipment, the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing. The chimney encompasses and is in fluid communication with the first and second openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.