Processing of material using non-circular laser beams

US10589384B2 · kind B2 · utility

Assignee

• HIGH Q LASER GMBH · AT

Inventors

• Frank Hendricks · Bad Waldsee, DE
• Victor Matylitsky · Gettorf, DE

Key dates

• Filing date: Jul 8, 2015
• Grant date: Mar 17, 2020
• Expiry date: Jul 8, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P40/57
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Method for processing of material by use of a pulsed laser Each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of particular shape and has a main extension axis of greater extent than its minor extension axis. One major crack is effected by each laser pulse, the major crack having a lateral extension basically oriented according to the main extension axis of the respective pulse in the focal point. Furthermore, each laser pulse is emitted so that the orientation of its main extension axis in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path at the assigned processing point.