Au—Sn—Ag-based solder alloy and solder material, electronic component sealed with the same Au—Sn—Ag based solder alloy or solder material, and electronic component mounting device
US10589387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2015 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | May 31, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An Au—Sn—Ag-based solder alloy for high temperature use containing Sn, Ag, Au and elements that are inevitably contained owing to manufacture procedure, wherein the Au—Sn—Ag-based solder alloy has a composition adjusted so that a solidus temperature is within a range of 280 to 400° C. with a gap between the solidus temperature and the liquidus temperature being within 40° C. The Au—Ag—Sn-based solder alloy has low cost, and is excellent in solderability, reflow wettability and reliability. The excellent reflow wettability of the Au—Ag—Sn-based solder alloy allows it to be useful in reflow bonding of crystal quartz devices, SAW filters and MEMS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.