Curable resin composition, method for curing same, and sheet manufactured therefrom
US10590217B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Dec 11, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a curable compound, a photoinitiator, and a curable resin composition comprising at least two types of thermal initiators, each having different initiation reaction temperature. Since the curable resin composition can improve a curing rate while having a high conversion rate, the curable resin composition is suitable for manufacturing thick films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.