Resin composition for display substrate, and heat-resistant resin film, organic EL display substrate, and method for manufacturing organic EL display using same
US10590306B2 · kind B2 · utility
1Cited by
1References
7Claims
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Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Sep 30, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.