Hot melt adhesive composition
US10590313B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jul 10, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J123/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides a composition. In an embodiment an adhesive composition is provided and includes
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.