Patent · US Active

Electroless copper plating compositions and methods for electroless plating copper on substrates

US10590541B2 · kind B2 · utility

0Cited by

4References

10Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Alejo M. Lifschitz Arribio · Waltham, US
Donald E. Cleary · Littleton, US

Key dates

Filing date	Jun 15, 2018
Grant date	Mar 17, 2020
Priority date	—
Expiry date	Sep 19, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C18/405
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.