Copper electroplating baths containing compounds of reaction products of amines and quinones
US10590556B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Oct 8, 2015 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Dec 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.