Apparatus, system, and method for improved heat spreading in heatsinks
US10591964B1 · kind B1 · utility
5Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2017 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Feb 14, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed apparatus may include (1) a plurality of vapor chambers that (A) are mounted to a plurality of individual power components that dissipate heat within a computing device and (B) absorb heat dissipated by the plurality of individual power components within the computing device and (2) at least one thermal coupling that (A) physically bridges the plurality of vapor chambers to one another within the computing device and (B) facilitates heat transfer among the plurality of vapor chambers mounted to the individual power components. Various other apparatuses, systems, and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.